For customers designing Texas Instruments CC1xxx, CC2xxx, CC430, CC85xx series Low Power RF applications
The following provides a basic explanation of design considerations for the external oscillation circuit using quartz crystal for 'Low Power RF' technology including ZigBee,IEEE802.15.4 and sub 1 GHz band wireless applications. "Please refer to Texas Instrument ZigBee/IEEE802.15.4 and sub 1 GHz band solution below."
Clock solution recommendations
In realizing low power consumption RF designs, the following factors should be taken into consideration.
- Oscillation start-up time
- Frequency tuning
- Lower BER(Bit Error Rate) over operating temperature
| No. | Oscillation Circuit Factor | 2.4 GHz , sub 1 GHz | sub 1 GHz(narrow band) |
|---|---|---|---|
| AT crystal unit spec. | TCXO spec. | ||
| 1 | Quick oscillation start-up time - High oscillation allowance - Boost inverter |
Lower ESR(R1) High drive level |
Quick start-up time |
| 2 | Easy frequency control - inner frequency tuning capacitor |
proper frequency sensitivity low parameters' variation |
High frequency stability |
| 3 | Lower BER - temperature compensation |
High frequency stability | High frequency stability |
| MHz Crystal equivalent circuit |
 |
| Oscillation start-up time -> Lower ESR (R1) , Higher C1 -> Higher drive level |
|
| Suitable Frequency Tuning -> Lower parameters variation(C0,C1,L1,ESR) |
|
| Suitable Frequency Tuning -> Proper Sensitivity (CL,C0) |
|
| Higher Frequency Stability -> Stable fSTA |
|
Texas Instruments MSP430 clock solution Here
For CC1xxx Series, CC430 Family
sub 1GHz band
| IC Name | Epson products | |||
|---|---|---|---|---|
| Product Name | Frequency [Hz] | CL [pF] | Product Code | |
|
CC1101, CC1110, CC1111, CC1100E
|
TSX-3225
|
26M
|
10
|
|
|
FA-128
|
26M
|
9
|
||
|
CC1120, CC1200, CC1121
(narrow band system) |
FA-128
|
32M
|
10
|
|
|
FA-20H
|
32M
|
10
|
||
|
TG-5035CG
|
32M
|
-
|
||
|
CC1125
(narrow band system), CC1175 |
FA-128
|
40M
|
10
|
|
|
FA-128
|
32M
|
10
|
||
|
FA-20H
|
40M
|
10
|
||
|
FA-20H
|
32M
|
10
|
||
|
CC1312, CC1352
|
FA-128
|
48M
|
7
|
|
|
CC430
|
TSX-3225
|
26M
|
10
|
|
|
TSX-3225
|
48M
|
16
|
||
(261KB)Notes:
Above recommendations are based on actual evaluation results and intended to support users in picking the right components. And the results are only according to the sample set that received from our customers, so it is not including the dispersion trend of IC and the external parts.
As the actual board layout and choice of external components influences the best suitable crystal load capacitance, We do not assume any responsibility and grant warranty for above recommendations. Users design must be verified and decided by own and individual evaluation.
For CC2xxx and CC85xx Series
2.4 GHz band
|
ZigBee IEEE802.15.4
Proprietary 2400 MHz to 2483.5 MHz |
Eeson products | |||
|---|---|---|---|---|
| Product name | Frequency [Hz] | CL [pF] | Product code | |
|
CC2500
|
FA-128
|
26M
|
10
|
|
|
CC2510
|
FA-128
|
26M
|
9
|
|
|
CC2511
|
TSX-3225
|
40M
|
16
|
|
|
CC2520
|
TSX-3225
|
32M
|
16
|
|
|
CC2530, CC2531
|
FA-20H
|
32M
|
16
|
|
|
FA-20H
|
32M
|
12
|
||
|
FA-128
|
32M
|
12
|
||
|
TSX-3225
|
32M
|
16
|
||
|
CC2533
|
FA-128
|
32M
|
12
|
|
|
CC2538
|
FA-128
|
32M
|
10
|
|
|
CC2540
(Bluetooth Low Energy) |
FA-20H
|
32M
|
16
|
|
|
CC2540, CC2541
(Bluetooth Low Energy) |
FA-128
|
32M
|
10
|
|
|
CC2541
(Bluetooth Low Energy) |
FA-20H
|
32M
|
10
|
|
|
CC2550
|
TSX-3225
|
26M
|
16
|
|
|
CC256x
(Bluetooth BR/EDR/LE) |
FA-128
|
26M
|
9
|
|
|
FA-20H
|
26M
|
9
|
||
|
CC2612, CC2652
|
FA-128
|
48M
|
7
|
|
|
CC2570, CC2571
(ANT RF network processor) |
TSX-3225
|
32M
|
10
|
|
|
CC13xx, CC26x0
|
TSX-3225
|
24M
|
9
|
|
|
CC85xx
(Wireless Audio Streeming) |
TSX-3225
|
48M
|
12
|
|
|
TSX-3225
|
48M
|
16
|
||
|
FA-128
|
48M
|
16
|
||
|
FA-128
|
48M
|
10
|
||
refer to: Crystal Selection Guide for CC253x,CC254x link to Texas Instruments sitepdf.
Notes:
Above recommendations are based on actual evaluation results and intended to support users in picking the right components. And the results are only according to the sample set that received from our customers, so it is not including the dispersion trend of IC and the external parts.
As the actual board layout and choice of external components influences the best suitable crystal load capacitance, We do not assume any responsibility and grant warranty for above recommendations.
Users design must be verified and decided by own and individual evaluation.
Please refer to Texas Instruments CC2xxx manual for designing.